The goal of this research is to develop a systematic, accurate and robust method for printed circuit board (PCB) positioning evaluation in the testing fixture. Theoretical analysis and experimental observation of tolerance distribution in bed-of-nails fixture were involved. Actual deformation of PCB (translation, rotation and deflection) could be obtained based upon a proposed model. The combined accuracy of the test lands positioning (false failure rate) were estimated by the Weibull distribution. All data processing was finished by MATLAB. Results will be helpful for evaluation of the minimal size of the PCB test lands and modification of the testing fixtures.

应力波的激光产生和检测，是一个受到各领域专家关注的、在无损检测和应用力学等方面有着极大应用潜力和研究兴趣的新兴领域。针对其力学方面、实验技术和应用前景等，本文对有关原理、方法、技术和实用进行了简要的归纳与总结。

Dynamical characteristics of PZT actuated transducer assembly are the key to reliable flip-chip bonding and basic understanding of metal interconnection. A systematic experimental observations and analysis clearly exhibit that, rich phenomena and effects like the negative cubic stiffness, dynamical coupling between transducer body and tool, velocity dropping and anomalous phase portrait of the die movement, may be explained by nonlinear features and non-parallel loading of transducer assembly onto its bonding area. It will be possible to explore their mechanism and effects to bonding quality by identifying and decoding them.

Aluminum wire bonding was performed on a lab test-bed with PZT transducer device. Vibration behavior of bonder transducer was monitored, and the correlations between bonding pressure, high frequency tool vibrations, and average bond strength were then demonstrated to determine the statistically significant differences among them. Wavelet decomposing, combined with statistics-based data processing, was utilized to explore the details of bonding process and evade inherent bonding uncertainties. Experimental results show that the method is practical and effective even if the interactions between transducer and its bonding target are very small. The obtained time-frequency plots were depicted for identifying un-modeled wire bonding dynamics.