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2005年05月16日

【期刊论文】Evolution of microstructure and dimension of as-molded parts during thermal removal process of wax2based MIM binder ①

李益民, LI Yi-min (李益民), HUAN Gbai-yun (黄伯云), LI Songlin (李松林), ZEN G Zhou-shan (曾舟山), QU Xuan-hui (曲选辉)

Trans. Nonferrous Met. Soc. China Jun. 2001 Vol. 11 №.3  ,-0001,():

-1年11月30日

摘要

The evolution of the microstructure and the dimension of as-molded parts were studied on the basis of the thermogravimetric analysis of wax-based MIM binder. The results show that the binder removal speeds are different in different temperature ranges during binder removal process. The evolution of the microstructure of as-molded parts during binder removal process clearly showed the initiation and formation of connected pore structure , which is the removal chan-nel of the binder. The as-molded parts almost continuously shrank through binder removal process, except an expansion stage during 320~440℃, which is the dissolution expansion effect due to the dissolution of VPW in the polymer melt.

binder, as-molded parts, microstructure, dimension

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2005年05月16日

【期刊论文】 Powder injection molding WC-Co cemented carbide

李益民

,-0001,():

-1年11月30日

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  • 李益民 邀请

    中南大学,浙江

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