为测试微悬臂芯片的动态特性，建立以压电陶瓷为激振底座的测试系统。采用白噪声、稳态正弦和快速 正弦( 啁啾信号) 扫频方式激励微叠层悬臂芯片，由多普勒测振仪测试芯片动态响应。通过分析压电陶瓷阻抗变化与芯 片动态响应，获得的频率对应于压电陶瓷激振器所激励叠层芯片的一阶共振频率，可作为微结构和器件动态分析的测试 方案。

使用常规、微观电镜、动力相图和统计时频分析等方法, 进行了引线键合机理的实验研究. 通过对换能 系统和劈刀振速的高频分量、键合压力的测试, 以及键合界面微观结构的观察, 建立了键合区域宏观受载等效模型, 和对键合机理的框架认识. 可作为键合过程优化的指导, 和键合动力学建模的依据.

Fiber optic sensors (FOS) for vibration monitoring of smart structures have certain advantages over conventional strain gage based sensors due to electromagnetic environment insensitivity and high response bandwidth. During the present study, a spatially integrating fiber optic sensor was used for vibration monitoring. It is based on the concept that the optimal placement of the sensing element can be sought by using a priori knowledge of the mode shapes of the structure. The applicability of this approach to polarimetric optical fibers is described. The acquired integrating FOS signal was used to sense and control the vibration of an eleetrorheological adaptive structure subjected to a random external excitation.

Microelectronics packaging has been developing rapidly due to the demands for faster, lighter and smaller products. Printed circuit boards (PCBs) provide mechanical support and electrical interconnection for electronic devices. Many types of composite PCBs have been developed to meet various needs. Recent trends in reliability analysis of PCBs have involved development of the structural integrity models for predicting lifetime under thermal environmental exposure; however the theoretical models need verification by the experiment. The objective of the current work is the development of an optical system and testing procedure for evaluation of the thermal deformation of PCBs in the wide temperature range. Due to the special requirements of the specimen and test condition, the existing technologies and setups were updated and modified. The discussions on optical methods, thermal loading chambers, and image data processing are presented. The proposed technique and specially designed test bench were employed successfully to measure the thermal deformations of PCB in the 40 C to +160 C temperature range. The video-based moir!e interferometry was used for generating, capturing and analysis of the fringe patterns. The obtained information yields the needed coefficients of thermal expansion (CTE) for tested PCBs.

The goal of this research is to develop a systematic, accurate and robust method for printed circuit board (PCB) positioning evaluation in the testing fixture. Theoretical analysis and experimental observation of tolerance distribution in bed-of-nails fixture were involved. Actual deformation of PCB (translation, rotation and deflection) could be obtained based upon a proposed model. The combined accuracy of the test lands positioning (false failure rate) were estimated by the Weibull distribution. All data processing was finished by MATLAB. Results will be helpful for evaluation of the minimal size of the PCB test lands and modification of the testing fixtures.