用高速摄像系统记录不同打火参数下打火杆放电、尾丝熔化成球的序列图像。通过MATLAB对图像进行图像处理，得到最终成球直径及其球心与尾丝的偏距。实验发现，在较大的打火电流(I=60mA)或较小的预设球直径(D=40. 64μm) 等条件下，球心与尾丝中心线的偏距不稳定且相差较大，易出现高尔夫球现象，严重影响引线键合的质量。

为测试微悬臂芯片的动态特性，建立以压电陶瓷为激振底座的测试系统。采用白噪声、稳态正弦和快速 正弦( 啁啾信号) 扫频方式激励微叠层悬臂芯片，由多普勒测振仪测试芯片动态响应。通过分析压电陶瓷阻抗变化与芯 片动态响应，获得的频率对应于压电陶瓷激振器所激励叠层芯片的一阶共振频率，可作为微结构和器件动态分析的测试 方案。

The effect of the temperature on bondability and bonding process for wire bonding are investigated. Bondability is characterized by shear bonding strength and bonding process is represented by input and output power of ultrasonic transducer. A laser Doppler vibrometer and Labview software were used to record the velocity, voltage and current of transducer at different temperature settings. A K-type thermocouple sensor was used to measure the bonding temperature. Experimental results show that unsuccessful bonding happens at low temperature, and over bonding appears if the temperature is too high. Only when the temperature is at appropriate settings, can a stable and satisfied bondability be attained. The reason for this experimental observation is analyzed. By using a high resolution transmission electron microscope, the atom diffusion depth of Au-Ag bonding interface was measured and the result is about 200 nm. By using joint time-frequency analysis, the instantaneous characteristics of bonding process were observed completely and clearly. It is found that input and output ultrasonic power vs. time-frequency in a bonding process, including resonance frequency, harmonic components and amplitude of ultrasonic energy, vary along with the change of temperature settings.

The lift-off characteristics at the interface of thermosonic bond were observed by using scanning electron microscope (JSM-6360LV). The vertical section of bonding point was produced by punching, grinding and ion-sputter thinning, and was tested by using transmission electron microscope (F30). The results show that the atomic diffusion at the bonded interface appears. The thickness of AdAI interface characterized by atomic diffusion is about 500 nm under ultrasonic and thermal energy. The fracture morphology of lift-off interface is dimples. The tensile fracture appears by pull-test not in bonded interface but in basis material, and the bonded strength at interface is enhanced by diffused atom fiom the other side.

使用常规、微观电镜、动力相图和统计时频分析等方法, 进行了引线键合机理的实验研究. 通过对换能 系统和劈刀振速的高频分量、键合压力的测试, 以及键合界面微观结构的观察, 建立了键合区域宏观受载等效模型, 和对键合机理的框架认识. 可作为键合过程优化的指导, 和键合动力学建模的依据.