制备了Cu-6%Ag及Cu-24%Ag合金铸锭并进行了均匀化处理。通过在合金中添加0.1%混合稀土的方法，研究了稀土元素对高Ag含量和低Ag含量两种合金原始组织的影响。稀土元素可在一定程度上使合金中的共晶体数量增加，细化低Ag含量合金的铸态α基体晶粒，降低高Ag含量合金中被连续网状共晶组织包围的枝晶轴间距。在均匀化退火过程中，稀土元素可明显细化在α基体中析出的次生相，并使共晶组织更趋于分散和向离异共晶形态发展。

The crystal structure, crystallite morphology, film composition and absorption properties were investigated for the pyrite films sulfurated from iron films. The pyrite particles nucleate mainly from the transitional phases of iron sulfides formed in the films during 673K sulfurating while the pyrite particles nucleate directly from the iron bisulfides formed in the films during 773K sulfurating. There are higher sulfur contents and more obvious grain propagation in the film sulfurated at 773K than in that sulfurated at 673K. With prolonging sulfuration time at 673K, the optical absorption edge tends to increase and approaches to the ideal value as sulfurated over 20h. Low absorption edges exist in the films sulfurated at 773K.

The Ag/Cu bimetallic laminates were prepared by rolling bond at different temperature and annealing for different time at 673K and 1023K. Their microstructure, composition and hardness were investigated in the matrix or diffusion zone of the laminates. Dynamic recrystallization induced in rolling process produces the mixture microstructure containing deformed and equiaxial grains. There exists an incomplete recrystallized structure for the laminates annealed at 673K and a polygonal-grain structure for the laminates annealed at 1023K. The grain size in the strip matrixes increases with increasing rolling or annealing temperature. Recrystallization process during rolling or annealing causes the hardness reduction. The reduction is more significant in the Cu side of the laminates rolled at 873K and in the strip matrixes annealed for 0.5h. Faster velocity of Cu atom moving into the Ag side than Ag atom into the Cu side results in a position shifting of Cu concentration curve in the Ag side. The shifting becomes more significant with prolonging annealing time. In the Ag side of the laminates annealed at 1023K, there is a region of fine equiaxial grains along original interface and its width increases with prolonging annealing time. Some Cu-rich particles precipitate along grain boundaries in the fine grain region and can slightly harden the Ag strip component.

Cu/Ag bimetallic strips were prepared by roll bonding in the temperature range of 293-873K and sinter treating in the temperature range of 523-1073K. The interface peel strength was determined and the peeled surface morphology observed. The high peel strength is obtained from excellent metallurgical joint by atom interdiffusion and matrix recrystallization under the condition of sintering in 523-673K for the bimetallic strips rolled at ambient temperature. Sintering in the temperature range of 873-1073K results in greatly lost peel strength from more voids formed at the interface although some local contacts on the mated surface could melt and merge at 1073K. Low peel strength from poor metallurgical bonding is obtained if the bimetallic strips are only roll bonded at the temperature lower than 623K. The peel strength dramatically loses due to the thick oxide layer existed between the two strip surfaces when the bimetallic strips are roll bonded at excessively high temperature.

A parameter, notch insensitivity factor, has been derived in order to assess the stress concentration sensitivity of Al-Li based alloys. The effect of impurities and Ce element on the stress concentration sensitivity of Al-Li-Cu-Zr, Al-Li-Cu-Mg-Zr and Al-Li-Mg-Zr alloy sheets has been investigated and the dependence of the stress concentration sensitivity on the mechanical properties and microstructural parameters discussed. Deleterious impurities can enhance the stress concentration sensitivity especially for the conventional impurities in Al-Li-Cu-Mg-Zr alloy and for the alkali metal impurities in Al-Li-Cu-Zr alloy. Suitable Ce microalloying can reduce the stress concentration sensitivity to a certain degree and the benefit is more significant to the Al-Li-Cu-Zr alloy rich in the conventional impurities. When varying the composition systems, impurity kinds, impurity content, Ce element concentration and heat treating process makes the yield strength increase, fracture toughness decrease, partial recrystallised volume rise and grain size increase, the stress concentration sensitivity usually tends to increase. A special attention should be paid to the practical application of Al-Li alloys because there generally is high stress concentration sensitivity for the alloys as compared with conventional aluminum alloys.