Silver has grown its attraction of the scientists in microelectronic field recently. Electrochemical deposition of silver onto copper substrates by immersion method has been one of the keen topics. In this study, ethanol was used as the plating solution in which some chemicals were added. The silver deposits were characterized by a field emission scanning electron microscopy (FESEM), an atom force microscope (AFM), a transmission electron microscope (TEM) and a selected area electron diffraction (SAED). It was found that silver immersion using ethanol-based bath has good coverage feature. The highlands of the copper substrate are coated by silver particles whose sizes are around 12 nm, but those sizes at low-lying lands are a little smaller.

采用乙醛酸代替有害的化学药品(如甲醛)作为还原剂的化学镀技术,在工业纯铝片、工业纯钛片、以 TiN 作为扩散防护层的硅片和以 TiSiN 作为扩散防护层的硅片等难镀材料实现了化学镀铜.被覆铜镀层的表面形貌和晶粒结构的分析结果表明:不同基材对铜镀层的组织结构影响很大, 尤其在以 TiN 作为扩散防护层的硅片和以 TiSiN 作为扩散防护层的硅片上,获得了由平均尺寸为 50nm 的颗粒所构成的较精细镀层,为半导体器件采用铜金属化工艺提供了新的方法。

电化学工业的初期，阳极材料就是现成的工业结构材料。十九世纪末，人造石墨一发、明，就被广泛地应用于工业生产，人们开始意识到研究开发这种特殊材料的必要性。近代电化学特别是电极学的发展，对电极材料提出了更高的要求，而材料科学的发展又为电极材料的研究指明了方向。六十年代末，尺寸稳定性阳极问世了,它的出现极大地推动了电化学工业的发展。从此，作为材料科学和电化学交叉领域的电极材料的研究在各大工业国开展得非常活跃，使电极材料在理论上和应用上都得到迅猛发展。本文简要地介绍电极材料的作用，分类、特点及其应用。