In present paper, the anti-plane problem of thermal effect near crack tipregion of piezoelectric material subjected to electrical impact loading is investigated by means of the integral transforms and the singular integral equations. By introducing the thermal power, the temperature field near crack tip is finally obtained on the basis of the hypotheses of the uncoupling between the thermal field and the electro-mechanical fields and the adiabatic approximation. The numerical results indicate that a high temperature field of small region near crack tip is deduced when high electrical impact load is applied. Moreover, the results show that the temperature field strongly depends on crack size. However, the thermal effect of mechanical impact comparing with electrical impact may almost be neglected.

The wave function expansion method and singular integral equations are used to investigate the scattering of SH waves by a cylindrical piezoelectric inclusion partially debonded from piezoelectric matrix. For impermeable crack case, dynamic stress intensity factors are obtained and numerical results show the phenomenon of low frequency resonance for various debonding sizes and incident angles.

The micro-scale adhesive contact behavior of a spherical rigid punch on a piezoelectric half-space is investigated in this paper. The governing equations describing the adhesive contact behavior are obtained by using the Maugis-Dugdale (M-D) elastic adhesive contact theory [J. Colloid Interface Sci. 150 (1992) 243]. The solutions for indentation of piezoelectric materials and for elastic adhesive contact can be reduced from the present results in the absence of adhesion effect and piezoelectric effect, respectively. The effect of the electric load on the adhesive contact behavior is analyzed. It is shown that the piezoelectric effect has a significant effect on the adhesive contact behavior of piezoelectric materials. The obtained results will be helpful to understand the micro-indentation properties of piezoelectric materials.

The scattering problem of a plane elastic wave by an interface crack between a piezoelectric layer and an elastic substrate is analyzed by means of the integral transform and the Cauchy singular integral equation methods. The effects of the crack configuration, the incident direction of the wave and the material combinations are examined.